| Feature | Capability |
| Quality Grade | Standard IPC 2 |
| Number of Layers | 2 – 24layers |
| Order Quantity | 1pc – 10000+pcs |
| Build Time | 2days – 5weeks |
| Material | S1150G, S1165 |
| Board Size | Min 6*6mm | Max 457*610mm |
| Board Thickness | 0.4mm – 6.5mm |
| Copper Weight (Finished) | 0.5oz – 2.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP – Organic Solderability Preservatives – RoHS |
| Min Annular Ring | 4mil |
| Min Drilling Hole Diameter | 6mil |
| Other Techniques | Gold fingers Blind/Buried Vias |