Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 2 – 24layers |
Order Quantity | 1pc – 10000+pcs |
Build Time | 2days – 5weeks |
Material | S1150G, S1165 |
Board Size | Min 6*6mm | Max 457*610mm |
Board Thickness | 0.4mm – 6.5mm |
Copper Weight (Finished) | 0.5oz – 2.0oz |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP – Organic Solderability Preservatives – RoHS |
Min Annular Ring | 4mil |
Min Drilling Hole Diameter | 6mil |
Other Techniques | Gold fingers Blind/Buried Vias |