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Electronic Systems Design & Manufacturing

PCB design & manufacturing for the ESDM ecosystem.

Every electronic product depends on the printed circuit board at its core. We design, fabricate and test multilayer, HDI and semiconductor test boards that meet global standards.

Our focus

Where the PCB fits in every product

From chip design through to the finished product, the PCB is where components become a working system. That makes board quality decisive for performance, reliability and cost.

Vayu concentrates on the part of the value chain where precision matters most: high-density boards and the specialised test boards used to validate semiconductors. Working alongside our technology partner, we bring proven processes to Indian OEMs and global customers alike.

HDI PCB panel
Value chain

The electronics manufacturing journey

From concept to finished product — Vayu delivers the PCB design and fabrication stages.

Product Design

Product and circuit design

Chip & Substrate

IC fabrication and packaging

PCB Design

Layout, stack-up and DFM — Vayu

PCB Fabrication

Multilayer & HDI boards — Vayu

Assembly & Test

PCBA and product validation

Services

What we deliver

PCB Design & DFM

Complete layout services and manufacturability reviews that cut re-spins and shorten time-to-market.

Design capabilities

Bare-Board Fabrication

Standard multilayer and HDI/UHDI PCBs for automotive, medical, telecom, aerospace and industrial use.

Manufacturing capabilities

Semiconductor Test Boards

Probe cards, load boards, burn-in boards and Hi-Fix boards engineered for high-frequency, fine-pitch test.

Ask about test boards
Semiconductor test board
Semiconductor test boards

Boards built for the test floor

Wafer-level and final test put extreme demands on a board: very high layer counts, fine-pitch probe interfaces, high-frequency signals and repeated thermal cycling.

  • Probe cards for wafer-level testing
  • Load boards for final test
  • Burn-in boards for reliability screening
  • Hi-Fix boards for memory and SoC test
  • Supplied to Fabs, OSATs and ATMP facilities
Technology

Board technologies

FR4 multilayerHigh-Tg FR4HDI 1+N+1 to any-layerBlind & buried viasVia-in-padControlled impedanceHigh-frequency / RFHeavy copperMetal-core (MCPCB)Flex & rigid-flexEmbedded passivesENIG / ENEPIG / OSP finishes

Start with a free DFM review

Send your design files and we’ll highlight any manufacturability risks before you commit to a build.