High-speed, HDI and complex multilayer layouts from a design team that thinks about fabrication from the very first trace.
Our technology partner brings decades of experience in HDI, semiconductor test boards and complex multilayer design.
Every layout is checked with industry-standard DFM/DFA tools for accuracy, yield and reliability.
We work natively in the leading EDA tools, so your files fit straight into your existing flow.
All projects run under strict NDAs with end-to-end protection of schematics and design data.
Netlist, schematic, BOM and mechanical constraints.
Layer stack, impedance and design-rule planning.
Component placement, high-speed and HDI routing.
Signal-integrity, EMI and manufacturability checks.
Gerbers, drill files, fab & assembly drawings.
Complex, dense boards are our everyday work.
| Item | Capability |
|---|---|
| Max layer count | 40 |
| Min trace / space (HDI) | 3 mil / 3 mil |
| Max pin count | 60,000 |
| Min BGA pin pitch | 0.3 mm |
| Max BGA pin count | 2,500 |
| Max signal rate | 12 Gbps |
| Min aperture | 3 mil |
We specialise in the details that make dense, fast boards work first time:

The more we know up front, the faster we can quote and start layout.
Tell us about your board and timeline — we’ll respond with an approach and a quotation.